Board type: High Tg, thick copper multilayer board
Material: High Tg(Tg 170) FR4,
Copper weight: thick copper, 4OZ(140um) each layer,
Layer: 12 layers board
Surface finish: ENIG
Board thickness: 3.2mm
Buried/blind vias
Application: DC/DC power module
High Tg, Thick Copper Multilayer Board